A 200µm long ‘T’ structure has been machined with our Hyperion FIB, for subsequent tensile strength testing. The machining time for a Ga+ FIB would be approximately 4 hours with a 40nA beam. However, with equal milling resolution, we have machined this in just 20 minutes with a 300nA Xe+ beam.
A custom, small area infra-red diffraction grating machined in silicon with our Xe+ plasma FIB, to avoid gallium implantation. Each 4µm wide groove takes ~15minutes to machine to a length of 150µm, with a 5nA Xe+ beam.
Plasma sprayed molybdenum coating on aluminum alloy substrate. Cross-sectional analysis reveals 3-5µm thick layers of columnar grains, along with some inter-layer voids. Our Hyperion FIB has been used to prepare a 300µm long cross-section, through a 300µm thick layer of molybdenum.
Characterization of Coatings with Ion and Electrons
Lucille A. Giannuzzi, Noel S. Smith and Sanjay Sampath, Microscopy and Microanalysis, 19 (Suppl 2), p1862, 2013.
Cross-sectioned ‘Through Silicon Vias’ (TSV’s), for studying the copper electro-deposition process in high aspect ratio vias. The cross-sections are 100µm wide, through a row of 5µm x 50µm vias. Plasma FIB machining time is 45-60 minutes for each cross-section.